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	AlN 140 / 180
	Alumina 96% / 99,6%
	Glass Encapsulent FK 4027
	AgPd - Thick Film Metallization
	Ag - Polymer - Thick Film Metallization
	Au - Thick Film Metallization
	AlN - Cooler
	Active metal brazed copper on AlN (ABC)
	Ti-Ni-Au - Thin Film Metallization
	Ti-Pd-Au - Thin Film Metallization
	Ti-Pt-Au - Thin Film Metallization
	AgPt - Conductor Paste for AlN-Substrates
	AgPd - Conductor Paste for AlN-Substrates
	Series Resistors for AlN-Substrates